2013年4月16日 星期二

EDA design methodologies led by next-generation FPGAs


FPGAs have become some of the most important drivers for development of leading edge semiconductor technology. The complexity of programmable devices, and their integration of diverse high-performance functions, provides excellent vehicles for testing new processes. It’s no accident that Intel has selected Achronix and Tabula, both makers of programmable devices, as the only partners that have been granted access to their 22 nm 3D Tri-Gate (FinFET) process. In February, Intel also announced an agreement with Altera, which will enable the company to manufacture FPGAs using their next-generation 14 nm Tri-Gate process.
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In parallel with driving manufacturing, FPGA technology development must also include enhancements to design tools and flows. As vendors strive to make their devices more SoC- and ASIC-like, they are also adopting standards and collaborating with EDA companies to integrate their tools more seamlessly. These collaborations are producing great benefits for designers, as FPGA design methodologies are leading the way in areas that the EDA industry has long been promising new capabilities, such as in Electronic System Level (ESL) synthesis, IP integration and re-use, and higher-level tools for software/hardware co-design.
FPGA design methodologies have long integrated EDA point tools, such as simulation and PCB design, into FPGA vendor’s design platforms. Now, vendors such as Synopsys, with their Synplicity tools, and Xilinx with Vivado, are collaborating to build more complete integrated top-to-bottom flows. To address the greater complexity of FPGAs that may now contain up to two million equivalent logic cells, Synopsys has added Hierarchical Project Management (HPM) to Synplicity. HPM supports distributed design teams and parallel development, enabling partitioning of RTL and sharing of design debug tasks. Xilinx has adopted the industry-standard Synopsys Design Constraint (SDC) timing constraints (to replace Xilinx proprietary UDC) in a design flow that can be driven from standard Verilog HDL.


EASING IP INTEGRATION

Easier integration and re-use of semiconductor IP, especially when sourcing from multiple vendors, has been one of the greatest challenges to SoC designers and EDA tool flows. With the advent of higher capacity FPGA-based SoCs that utilize embedded ARM cores, those same challenges are now extended to the world of FPGA design.
One of the methods that the EDA and IP industry has developed to ease the problem is the adoption of a standard for IP description formats, the IP-XACT standard. IP-XACT was originally developed by the SPIRIT Consortium of companies that included ARM, Cadence, Mentor, and Synopsys. SPIRIT merged with EDA Standards organization Accellera in 2010. The IEEE adopted IP-XACT as the IEEE Std-1685 in 2009, and has made the specification available to download free from the organization’s website. The specification defines the use of XML meta-data to document the characteristics of IP, and an API to enable integration with EDA tools.
Xilinx has announced that they are supporting IP-XACT in their new Vivado IP Integrator (IPI), to ease the integration of their own and third-party IP. IPI is available to Xilinx’s early access customers along with the release of the latest revision of the Vivado Design Suite 2013.1. In a demonstration video from Xilinx, IPI appears to provide a very easy to use schematic-driven graphical user interface, which enables “correct-by-construction” block-level assembly of complex designs. Xilinx says the system can also be run in a tcl script-driven mode.
IPI enables users to select IP blocks from a library, place the blocks on a schematic, and then simply point and click to draw the interconnections between blocks, I/O pins, and AXI busses. The system prevents invalid connections from being made, and alerts the user to errors with a built-in validation function. A user can start by selecting the target FPGA from the Vivado library or choose one of Xilinx’s evaluation boards, which will include information on other onboard components such as external DRAM, so that interfaces can be included as part of the FPGA design process. Designer assistance is provided to ease construction of larger functional blocks, such as MicroBlaze processor subsystems. After completion of the block-level design, and final DRC validation, users can utilize Vivado’s HDL generation functions to create Verilog or VHDL to drive synthesis and place and route.

INDUSTRY STANDARDS ENABLE HIGHER LEVELS OF ABSTRACTION

Building on their 2011 acquisition of AutoESL, Xilinx also says that they have expanded their C/C++ system-level design library for High-Level Synthesis (HLS) in the new Vivado release. Xilinx is targeting the growing market for embedded vision applications, following on their participation as a founding member of the Embedded Vision Alliance, with support for industry standard floating point math.h operations and real-time video processing functions. Designers of embedded vision systems will be able to utilize Vivado HLS integrated with the Open Source Computer Vision Library provided by the OpenCV organization. OpenCV is an open source BSD-licensed library of computer vision functions, which supports Windows,Linux, Mac, Androidand Apple iOS operating systems. Vivado users will be able to develop embedded vision applications for the dual-core ARM Cortex A9 processor system in Zynq FPGAs, augmented with special-purpose hardware accelerators built in the programmable logic fabric.
Today’s most advanced SoCs are highly parallel heterogeneous computing systems, which challenge the traditional low-level HDL-based programming model. Altera has been leading the FPGA industry in promoting the use of OpenCL, an industry standard for parallel programming of systems containing a mix of CPUs, GPUs, and DSPs, which is maintained by the Khronos Group. In November last year, Altera released their first SDK for OpenCL to early access customers, as part of the version 12.1 update of their Quartus II suite of design tools. Hardware platforms that support the OpenCL SDK are becoming available, starting with the Nallatech 385 PCIe accelerator card, which employs Altera Stratix V FPGAs.

THE FUTURE OF FPGAS

Advances in FPGA tools and flows are good news for designers of programmable logic systems as well as ASIC and SoC designers. At a recent Synopsys User Group tutorial on the Synplicity-Vivado flow, the large majority of attendees were involved in FPGA prototyping, where the latest high-capacity FPGAs have become critical tools for design validation and signoff for complex SoCs. By utilizing the same design languages and standards for both ASIC and FPGA design, much duplication of effort can be eliminated and faster time-to-market will result.

 

 

refer to :
http://dsp-fpga.com/articles/advances-in-eda-design-methodologies-led-by-next-generation-fpgas/

2013年4月3日 星期三

Configurable AFE eases calibration trial and error

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Looking at the hundreds of different types of sensors available, one can observe common topologies and signal characteristic ranges and understand that having the ability to simply change the characteristics of the op-amps, or to dynamically change the gain values, will significantly reduce the complexity and reduce development time.
The Renesas Smart Analog technology is an example of a fully configurable AFE technology that allows for such capability. As Figure 2 shows, such technology includes five elements: three separate configurable amplifiers, an additional amplifier with sync detection capability, a general-purpose op-amp, a low-pass filter with variable cutoff frequency, and lastly, a high-pass filter with variable cutoff frequency.
refer to: http://embedded-computing.com/articles/latest-afe-simplifies-interfacing-hundreds-sensors/#at_pco=cfd-1.0

2013年3月25日 星期一

What's IT managers need...


IT managers are under increasing pressure to boost network capacity and performance to cope with the data deluge. Networking systems are under a similar form of stress with their performance degrading as new capabilities are added in software. The solution to both needs is next-generation System-on-Chip (SoC) communications processors that combine multiple cores with multiple hardware acceleration engines.

In-Vehicle Computer. single board computer, Industrial PC  


1.Networks under increasing stress
2. Moore’s Law not keeping pace
3. Hardware acceleration necessary, but …
4.Next-generation multicore SoCs


refer:http://embedded-computing.com/articles/next-generation-architectures-tomorrows-communications-networks/


2013年3月5日 星期二

Show longer medical device life expectancy

In vehicle computer, single board computer, Embedded pc
 

Like many other industries, health care has become much more agile as practitioners have tried to keep expenses under control. Smaller, more portable devices now enable more efficient and economical diagnostic and treatment procedures to be delivered at the patient’s bedside. Computers-On-Modules (COMs) are helping provide the portability, computing power, and integration needed to increase the longevity of medical device designs.

Electronic device manufacturers are increasingly using Computers-On-Modules (COMs) to produce compact, portable, and easily modified solutions for health care. In addition to smaller solutions, COMs enable longer product life, which is particularly desirable in medical equipment. One reason for this is the stringent and expensive certification process medical devices go through as mandated by the FDA. Furthermore, successful products often become industry standards that medical technicians must learn and adhere to.
By definition, COM designs are modular. The COM approach for embedded technology enables a medical solution’s processing power to be easily updated or upgraded while the physical dimensions and mounting system remain exactly the same. This allows the appearance of the industrial design to stay consistent with market expectations while providing for any needed upgrades. If a particular processor is reaching End-Of-Life (EOL), a module with a current processor can be introduced.
With COMs, the processor and supporting features are placed on a compact module that comprises a complete computer. The I/O for the system and the unique features that differentiate the customer’s product are included on a separate baseboard. Processor upgrades can be made by utilizing different processing modules that mate with the baseboard. This enables easy processor upgrades, plus various modules can be offered spanning a range of performance levels.
refer:
http://embedded-computing.com/articles/com-device-life-expectancy/

2013年2月25日 星期一

About designing remote health systems reaps rewards

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As the world’s population continues to age, remote health care ortelehealth devices are becoming an enormous growth area for the embedded systems industry. Low-cost, ubiquitously connected hardware and its associated services are rapidly growing in popularity, allowing doctors to monitor, diagnose, and treat specific health conditions remotely. Telehealth devices can also be used to provide remote data collection, patient reminders, multimedia content delivery, and wellness coaching by monitoring and adjusting the user’s daily fitness and diet.
For most health care device designs, embedded developers must address a number of common requirements, including a graphical interface and small form factor, patient safety, low-power operation, remote management, secure operation, and universal connectivity. In addition, these devices must be built with long-life support plus the ability to interoperate with other equipment in the field. Although hardware and software development for telehealth can be challenging, the rewards are significant, and manufacturers are rapidly seizing opportunities in the marketplace.
To delve into the latest technologies revolutionizing health care, we interviewed telehealth industry experts in this month’s Strategies section. Alan Boucher, Director of Software Architecture and Engineering at Intel-GE Care Innovations, a joint venture between Intel Corporation and GE Healthcare, explains how embedded technologies such as wireless connectivity, software, and sensors can be used to enable and enhance products in a telehealth environment. Also on the forefront of telehealth technology, Dr. Joseph Kvedar, founder and director of the Center for Connected Health, emphasizes the need for programs that move care from the hospital or doctor’s office into the day-to-day lives of patients by incorporating engagement strategies such as games, social networking, coaching, reminders, incentives, and punishments.

Refer:
http://embedded-computing.com/articles/designing-systems-reaps-rewards/

2013年2月19日 星期二

It is also the world’s biggest special-interest exhibition for embedded technologies

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The international embedded community meets for three days at its annual highlight in Nürnberg from 26–28 February – the embedded world Exhibition&Conference. The exhibition has been the main hub of one of the most dynamic and highly specialized technology sectors for over 10 years. It is the world’s biggest international exhibition and conference event on embedded system technology. “embedded world will remain focused in 2013 but still grow appreciably. It is the largest event in the world for embedded system technologies and the most professional shop window,” explains Alexander Mattausch, Exhibition Manager of the embedded world Exhibition&Conference at NürnbergMesse.
 
embedded world has been the most important event in the international exhibition calendar for both exhibitors and visitors for a decade. For example, nine out of ten exhibitors at embedded world 2012 confirm that the event is of great or exceptional importance for their marketing and sales activities.
It is also the world’s biggest special-interest exhibition for embedded technologies. “We are very pleased about yet more growth in terms of display space, number of new exhibitors and international share of exhibitors, which confirms the importance of the event,” says Mattausch.
Acrosser technology  ---------------->Booth Hall 2 2-519
 
 

2013年2月5日 星期二

Intel dual- core 1.86GHz Atom Processor D2550 AMB-D255T1

Networking appliance, Console server, Embedded pc
Networking appliance, Console server, Embedded pc
Mini-ITX mainboard, AMB-D255T1, which carries the Intel dual- core 1.86GHz Atom Processor D2550.AMB-D255T1 also provides complete I/O such as 4 x COM ports, 6 x USB2.0 ports, 1 x GbE RJ-45 port, 1 x SATA port with power connector. AMB-D255T1 as the slim type with single layer I/O ports to make the board total height less than 20mm, with external AC/DC power adaptor which is very suitable for applications with limited space likes Digital Signage, POS or thin client system.
.1 x DDR3 SO-DIMM up to 4GB
.1 x VGA
.1 x HDMI
.1 x 24-bit LVDS
.6 x USB2.0
.4 x COM
.1 x GbE (Realtek RTL8105E)
.1 x PS/2 KB/MS
.1 x MiniPCIe slot
.1 x SATA with power connector
.8-bit GPIO