Different approach allows designers to reduce the total power in embedded computer systems that use multiple memory modules and those that must run above +85 °C, which is a typical design challenge in a wide range of AdvancedTCA-based telecom and Ethernet blade switch networking applications.
Designers of telecom and networking blade systems typically face strict limitations on system height. In addition, these systems require spacing on top of the memory module to enable airflow for effective thermal management. Incorporating a reduced height DDR3L VLP memory module helps improve airflow and provides a low profile, allowing OEMs to offer higher-reliability products that reduce total cost of ownership. Specific DDR3L VLP modules also offer single refresh rates, which are now essential to maximize performance in high-temperature embedded systems.
refer to: http://embedded-computing.com/articles/ruggedization-memory-module-design/
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