2013年12月30日 星期一

The Reliable Software Developers’ Conference – UK, May 2014

Technology event organiser Energi Technical has announced that it will be launching "The Reliable Software Developers' Conference", scheduled for May 2014.
This one-day conference will provide an important forum for engineers and developers working in the development of safety critical systems and high availability systems. It is expected to attract software developers working in such industries as automotive, railway systems, aerospace, bankingmedical and energy. www.rsd-conference.co.uk
"In recent years, software has become so complex that ensuring safety and reliability is now a major challenge," said Richard Blackburn, Event Organiser. "Many systems now have millions of lines of code and will handle enormous amounts of data. Further to this, modern computer based systems will make millions of decisions every second and also have to be immune to interference and unpredictable events. This event will look at the MISRA coding standards, debug tools and software testing tools that are available to assist software programmers and engineers seeking to develop reliable and safety critical
The Reliable Software Developers' Conference will be co-located with the 2014 UK Device Developers' Conference. Both will be a one-day conference to be run in Bristol, Cambridge, Northern England and Scotland on May 20th, May 20rd, June 3rd and June 5th.
Delegates attending either event will have the opportunity to sit in on technical presentations and ½ day technical workshops and a attend a vendor exhibition of tools and technology for the development of real-time and embedded systems. www.device-developer-conference.co.uk
"Advanced Debug Tools, Code Test, Version Control, Verification Tools and Software Standards have been a growing feature of recent conferences, so it made sense to create a dedicated event," said Richard. "There will be a lot expertise available to delegates, and the chance to meet a broad range of vendors of test technologies and tools, all under one roof."
Developed in collaboration with MISRA (Coding Standards), the Reliable Software Developers' Conference will feature a number of presentations in the morning, followed by a half-day technical workshop in the afternoon. The presentations will be free and open to delegates of both Conferences, but the half-day workshops will be subject to a charge of £75. Delegates will learn about developments in coding standards, test and verification tools and best practices and it will also be an opportunity to meet with many industry experts.
Refer to:http://embedded-computing.com/news/the-uk-may-2014/

2013年12月23日 星期一

Acrosser wish you Happy Holidays and a very prospective 2014 coming soon!

As we near the end of 2013, Acrosser would like to send you our warmest New Year’s wishes! We wish you and your family health, comfort, and prosperity this holiday season.

We also thank you for keeping up with our latest products, sending us inquiries, and choosing our products for your integrated solution! In 2014, we hope you will continue to choose Acrosser. We look forward to assisting you and your company in becoming the leader in your vertical market, and building a win-win relationship together.

And don’t forget about our star product, AES-HM76Z1FL, and its upcoming Product Testing Event in January! Remember to mark your calendar, since Acrosser is lending the product for free only to selected participants! Please stay tuned for more event information in early January!

With your continuous dedication and our commitment to quality, Acrosser is always motivated to make your embedded idea a reality!

2013年12月16日 星期一

Comprehensive customization for network appliances: meet our rackmount and micro box!

ACROSSER Technology, a world-leading network communication designer and manufacturer, introduces two network appliances that deliver great performance and protection while simplifying your network. Each product has its own target market and appeals to a unique audience.
Acrosser’s ANR-IB75N1/A/B serves as an integrated Unified Threat Management (UTM) device that covers all of yournetworking security needs. Featuring a 3rd generation Intel Core i processor, increased processing throughput is easily made. For integration with information security systems, the device also features functions such as anti-virus, anti-spam, fire wall, intrusion detection, VPN and web filtering, in order to provide complete solutions to meet the demands of various applications.
Key features of the ANR-IB75N1/A/B include:
‧Support for LGA1155 Intel® Core ™ i7/i5/i3 processor / Pentium CPU
‧Intel B75 Chipset
‧2 x DDRIII DIMM, up to 16GB memory.
‧2 x Intel 82576EB Fiber ports
‧8 x Intel 82574L 10/100/1000Mbps ports
‧Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)
‧LAN bypass can be controlled by BIOS and Jumper
‧CF socket, 2 x 2.5” HDD, 1 x SATA III, 1 x SATA II
‧Console, VGA (pinhead), 2 x USB 3.0 (2 x external)
‧Support boot from LAN, console redirection
‧Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment
‧LCM module to provide user-friendly interface
‧Standard 1U rackmount size

As for our micro box, the AND-D525N2 provides more possibilities for different applications due to its small form factor (234mm*165mm*44mm). Aside from its space-saving design, the other 3 major features of the AND-D525N2 are its high performance, low power consumption and competitive price. Please send us your inquiry via our website (http://www.acrosser.com/inquiry.html), or simply contact your nearest local sales location for further information.

Key features of the AND-D525N2 include:
‧Intel Atom D525 1.86GHz
‧Intel ICH8M Chipset
‧x DDR3 SO-DIMM up to 4GB
‧1 x 2.5 inch HDD Bay, 1 x CF socket
‧4 x GbE LAN, Realtek 8111E
‧2 x USB2.0
‧2 x SATA II
‧1 x Console
‧1 x MiniPCIe socket

Besides In addition to these two models, Acrosser also provides a wide selection of network security hardware. With more than 26 years of rich industry experience, Acrosser has the ODM/OEM ability to carry out customized solutions, shortening customers’ time-to-market and creating numerous profits.

For all networking appliances product, please visit:

2013年12月10日 星期二


December 5, 2013 - The Chinese market for industrial Ethernet & Fieldbus Technologies grew by 18 million nodes in 2012. More than 3 million nodes used Ethernet and the remainder used Fieldbus technology.

Although Fieldbus has a large base of new connected nodes in China, the usage of Fieldbus is not as common as in developed countries such as Germany or the United States. This is mainly because Chinese customers are encountering networking technology much later than those developing countries.

However, the growing speed of Ethernet is quite considerable in China and we think it is a great opportunity for Chinese customers to upgrade their automation system under current market condition. Customers will just jump from old Fieldbus Technologies direct to Ethernet now and actually many of them are doing right now.  The Chinese market is currently engaged in extensive upgrading and new infrastructure construction, and that will require a great deal of Ethernet applications.

In China, international brands are quite influential. This is also true for industrial networking protocols because most of them having their supporting companies. For example, the most popular Fieldbus protocols in China are PROFIBUS and CC-Link, which are developed and promoted by Siemens and Mitsubishi separately, which command large market share in China.

On the other hand, some open protocols also have a large number of nodes connected, and the most representative ones are CANOpen, Modbus and HART. However, all three protocols don’t deliver strong functionality, and they are more likely to be used in low-end applications for easy connections.

With the upgrading of old facilities and the construction of new plants in China, customers also are being compelled to upgrade their systems using Ethernet. However, this move will not only be implemented by the customers, but also by the industrial automation vendors as well.

Most protocols have Ethernet variants. Because of this, many Fieldbus users will turn to the Ethernet of the application, for example, PROFIBUS to PROFINET, CC-Link to CC-Link IE. And the new automation products will also support those new Ethernet connections.

refer to:http://www.automation.com/portals/industrial-networks-field-buses/industrial-ethernet-growing-in-china

2013年12月1日 星期日

High Computing Performance for All Applications- F.I.T. Technology

The demand for computing performance in the IPC market continues to become stronger as the IT field advances. Acrosser’s new AES-HM76Z1FL has been designed to meet these demands.
The F.I.T. Technology used to build this new product reflects its 3 major features: fanless design, Intel core i processor and ultra thin frame. The fanless design not only reduces the risk of exposure to air dust, but also prevents fan-malfunction. With a height of less than 0.8 inches, AES-HM76Z1FL’s slim design makes itself FIT into every application.
As its structure and output interface show, AES-HM76Z1FL provides a wide range of choices, from HDMI, VGA, USB, and audio to GPIO output interfaces that suit almost all industries. For wireless communication needs, the AES-HM76Z1FL has a mini-PCle expansion slot which provides support on both 3.5G and WiFi.
Another fascinating feature of the AES-HM76Z1FL is its ease of installation for expansions. By disassembling the bottom cover, expansions such as CF cards, memory upgrades and mini-PCIe can be easily complete without moving the heat sink. Moreover, Acrosser adopts 4 types of CPU (Intel Core i7/i3, Intel Celeron 1047UE/927UE) for AES-HM76Z1FL, allowing it to satisfy the scalable market demands of different applications.
In conclusion, the AES-HM76Z1FL is truly a well-rounded product designed for diverse applications. To promote our star product AES-HM76Z1FL, Acrosser will launch a product testing campaign starting in January, 2014. Acrosser will provide selected applications with the new AES-HM76Z1FL for one month, and it’s free! For more detailed information, please stay tuned for our press release, or leave us an inquiry on our website at www.acrosser.com!

Product Information:

2013年11月24日 星期日


Over the last few years a number of automation vendors have announced various services including outsourced maintenance, system integration, manufacturing and business process consulting, and remote operations. I wonder if an automation vendor can continue to be effective as both a product company and services provider.

To clarify the difference, let’s start by defining what I mean by services and products. By providing services, automation vendors engage with customers to perform labor and knowledge intensive tasks that may include system design, engineering services, system integration, preventative maintenance, remote operations, and other services. By providing products, automation vendors sell something to the customers, system integrators and engineering firms that they will apply to accomplish automation tasks in manufacturing and process environments.

refer to:http://www.automation.com/portals/factory-discrete-automation/can-automation-vendors-serve-two-masters-products-services

2013年11月14日 星期四

Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

Acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, Acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as "F.I.T. Technology." (Fanless, Intel core i, ultra Thin)
The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.
The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.
Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

Contact us:

2013年11月4日 星期一

Introduction to model-based design

With model-based design, UAV engineers develop and simulate system models comprised of hardware and software using block diagrams and state charts, as shown in Figures 1 and 2. They then automatically generate, deploy, and verify code on their embedded systems. With textual computation languages and block diagram model tools, one can generate code in C, C++, Verilog, and VHDL languages, enabling implementation on MCU, DSP[], FPGA[], and ASIC hardware. This lets system, software, and hardware engineers collaborate using the same tools and environment to develop, implement, and verify systems. Given their auto-nomous nature, UAV systems heavily employ closed-loop controls, making system modeling and closed-loop simulation, as shown in Figures 1 and 2, a natural fit.

Testing actual UAV systems via ground-controlled flight tests is expensive. A better way is to test early in the design process using desktop simulation and lab test benches. With model-based design, verification starts as soon as models are created and simulated for the first time. Tests cases based on high-level requirements formalize simulation testing. A common verification workflow is to reuse the simulation tests throughout model-based design as the model transitions from system model to software model to source code to executable object code using code generators and cross-compilers.

Used during system design
Reused as an entry point for software design
Elaborated on during detailed software design (for example, by discretizing continuous time blocks and changing double-precision data to single-precision or fixed-point)
Used as input for embedded code generation

The test cases for system requirement validation likewise are reused on the model, source code, and executable object code to perform functional testing and collect coverage metrics.
While not advocating for any particular mapping, the use and reuse of models for systems and software design along with code generation have long provided UAV system developers using MathWorks products of Simulink and Embedded Coder with streamlined processes. It is nice to see that this same approach is now clearly acknowledged as an acceptable means to certification by the governing standards. MathWorks provides verification tool qualification kits and workflow guidance regarding the use of model-based design for DO-178.

refer to:

2013年10月28日 星期一

Asia claims almost half of Industrial automation solutions sales

A recent report by IHS has shown that in 2012, capital expenditure on industrial automation equipment in Asia reached a total of $76.6bn, representing 46% of global investments in the sector.

Despite this established and rising trend, selling industrial automation equipment in Asia remains a clear business opportunity and one where many European providers are lagging behind.

Despite the first half of 2012 seeing an Asian market slowdown, with only a 3.7% growth in overall revenue from industrial automation equipment, the second half of the year showed definite improvement. The positive trend has continued in 2013, with the industrial automation sector set to grow by 6.2%. In such a dynamic market, getting new business can be both a business and technical challenge.

One of the key areas of opportunity is the power industry, where the booming consumer and industrial power markets in developing economies such as China and India have created rocketing demand. In China the per capita energy use is still a long way behind most of Western Europe, meaning the potential for growth is still huge. Without question, Asia represents a perfect storm of opportunities for European automation suppliers.

In order to help businesses better understand how to take advantage of the current climate and increase their industrial automation sales in Asia, particularly China, the CC-Link Partner Association (CLPA) is hosting a seminar entitled ‘Gateway to China’. The event will take place on 24th September at the Mitsubishi Electric Europe Tokyo Conference Suite in Hatfield.

In light of the sensitive current economic climate, many Asian companies are taking a more careful approach to investment – they are becoming more demanding towards their suppliers and making more enquiries before purchasing. Furthermore, according to IHS’ research, several Chinese manufacturers are currently developing products which are in direct competition with the ones provided by Western suppliers of industrial automation solutions. These are only a few of the obstacles facing European vendors who want to penetrate the Asian market to change the way they do business.

Flexibility and the ability to respond to very specific demands are becoming essential factors when dealing with the Asian market. Being able to offer technologies and products which are compatible with the needs of Asian clients is no longer an option, it’s a must.

refer to:http://www.connectingindustry.com/automation/asia-claims-almost-half-of-automation-sales.aspx

2013年9月24日 星期二

DIY is back to the market

Resurgence of the Do It Yourself (DIY) community has driven a range of open hardware platforms, giving aspiring technologists cheap and easy access to embedded development. Outside of hobbyist toys and embedded computer  educational devices, however, "hacker" boards are increasing performance and I/O flexibility, and have become viable industrial  options for professional product development.

The “networking appliance” movements of the past few years quickly gained traction in the education and networking appliance market,  as organizations began producing open hardware boards with a “less-is-more” architecture at a price to match. DIY boards like the Arduino, BeagleBoard, and Raspberry Pi provide “known state” programming platforms that allow easy exploring for novice developers, and enough flexibility for advanced industrial  hackers to create some pretty remarkable things – which they have.

refer to:

2013年8月26日 星期一

Diverse actuator applications in power plant

ABB actuators avoid this effect by defining a small area in front of the end position.
As soon as the actuator reaches this area, single board computer behaves as if it were set to 'Drive to end position'. The three-phase asynchronous motor with cage rotor guarantees safe and reliable operation. The use of a frequency converter allows the torque and stroke time of the intelligent actuator to be varied. This means that both single board computers can be adapted to the actuating element or process independently of each other. The motor is constantly under voltage, and increases or reduces the torque gently and in proportion to the control deviation. The actuator is always switched on, meaning that no technology restrictions are placed on the control loop, even at the maximum permissible ambient temperature.

refer to: http://www.power-eng.com/articles/print/volume-117/issue-8/features/opportunities-to-improve-efficiency.html

2013年8月19日 星期一

Partnered business relationship heats up automation industry competition

JR Automation Technologies in Holland, MI, and AWL-Techniek, based in the Netherlands, announce a partnership. JR Automation,  in business since 1980, is a rapidly expanding embedded system automation company with experience in creating a wide range of solutions, from stand-alone operator assist stations to highly automated assembly lines.

With the advancement of customer success at the helm, the strategies of JR Automation and AWL-Techniek have aligned, creating a partnership that will allow global customer bases to benefit from an equally global system integrator presence. JR will service and support customers in the US, Canada, and Mexico, and AWL will support customers in Europe and China.

refer to: http://www.automation.com/jr-automation-and-awl-techniek-join-forces

2013年7月30日 星期二

Methods for embedded software debug

Much of the ways will be based around the embedded computers development and validation of Autosar compliant code and the development of code for specific devices such as the BOSCH GTM, the AURIX and Freescale's Nexus based Qorivva solutions. Some of the presentations will also touch on the debugging of code on multicore systems. Delegates will also have the opportunity to discuss their specific challenges and requirements. “Developing reliable software for safety critical automotive applications can be very challenging,” said Barry Lock. “We have recently developed several important new techniques, such as ‘long-term trace’. It is this kind of innovation that is enabling faster and more effective code development. I think engineers will greatly benefit from this Forum.”

2013年7月15日 星期一

Different approach to manage your embedded system data

Different approach allows designers to reduce the total power in embedded computer systems that use multiple memory modules and those that must run above +85 °C, which is a typical design challenge in a wide range of AdvancedTCA-based telecom and Ethernet blade switch networking applications.

Designers of telecom and networking blade systems typically face strict limitations on system height. In addition, these systems require spacing on top of the memory module to enable airflow for effective thermal management. Incorporating a reduced height DDR3L VLP memory module helps improve airflow and provides a low profile, allowing OEMs to offer higher-reliability products that reduce total cost of ownership. Specific DDR3L VLP modules also offer single refresh rates, which are now essential to maximize performance in high-temperature embedded systems.

refer to: http://embedded-computing.com/articles/ruggedization-memory-module-design/

2013年6月19日 星期三

Moving toward a brighter in-vehicle picture

Rackmount, Embedded SYSTEM, single board COMPUTER

Have you ever thought of moving toward a brighter, easier, smoother mobile way? The Bluetooth SIG has specified a standard mechanism for streaming high-quality mono or stereo audio from a Bluetooth master such as a smartphone to a slave device like an IVI system. The Advanced Audio Distribution Profile (A2DP) encodes 2-channel audio in a Bluetooth-friendly format, which is sent wirelessly and decoded at the Bluetooth receiver. The SBC audio codec is a mandatory component of the A2DP profile, but other industry standards and proprietary codecs can also be accommodated. Today, several proprietary radios enable keyless entry and proximity sensor capabilities to unlock car doors or start the ignition. But because these links are not based on standards, each accessory must be compatible with the specific proprietary technology or it will not work. Wireless SoCs that include Bluetooth Low Energy (LE) capabilities, however, enable interoperability with all in-vehicle wireless systems, allowing consumers to use any of their mobile accessories to open car doors or start the ignition. The dashboard so they can answer calls and check text messages.

refer to: http://embedded-computing.com/articles/wireless-accelerate-next-wave-in-vehicle-innovation/

2013年5月7日 星期二

(ESEC) Acrosser will highlight its latest endeavors on 2 major applications: networking and gaming

fanless computers, Panel PC, single board computers

ACROSSER Technology announces our participation in 2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.

At the 2013 ESEC, Acrosser will highlight its latest endeavors on 2 major applications: networking and gaming. For networking, the latest Rackmount product from Acrosser, the ANR-IB75N1, will be on display during the entire event. As for gaming applications, Acrosser will exhibit its new All-in-One Gaming BoardAMB-A55EG1. The board features great computing and graphic performance, and high compatibility on multiple operation systems. In addition, Acrosser also stresses its focus on other product lines, including Single Board Computers and In Vehicle Computer AIV-HM76V0FL.

2013年5月1日 星期三

Manage risk in Java...

When it comes to software development, the old adage is best spun in a slightly different way: better "early" than never. Accordingly, static analysis can help those developing in Java to stay one step ahead of potential coding problems.
Networking appliance, Console server,  Embedded pc
Today’s software development teams are under immense pressure; the market demands high-quality, secure releases at a constantly increasing pace while security threats become more and more sophisticated. Considering the high cost of product failures and security breaches, it is more important than ever to address these risks throughout the software development process. Potential problems need to be spotted early to prevent release delays or, worse, post-release failures. Fortunately, there are numerous tools to help developers manage these risks, helping to identify potential problems early in the development phase when issues are less disruptive and easier to fix. They are readily accessible to developers and easy to use within many development environments. This applies to developers programming in any language; however, we focus on Java in this discussion (see Sidebar 1). 1.Static analysis helps mitigate risk 2.Selecting static analysis tools for Java
6.Development testing – Tying it all together

refer to:

2013年4月23日 星期二

Acrosser at the 2013 ESEC

Networking appliance, Console server, Embedded system
At the 2013 ESEC, Acrosser will highlight its latest endeavors on 2 major applications: networking and gaming. For networking, the latest Rackmount product from Acrosser, the ANR-IB75N1, will be on display during the entire event. As for gaming applications, Acrosser will exhibit its new All-in-One Gaming Board, AMB-A55EG1. The board features great computing and graphic performance, and high compatibility on multiple operation systems. In addition, Acrosser also stresses its focus on other product lines, including Single Board Computers and In Vehicle Computer AIV-HM76V0FL.

New Product information:

(Networking Appliance)
Networking appliance, Console server, Embedded system


(Gaming Platform)

Networking appliance, Console server, Embedded system



2013年4月16日 星期二

EDA design methodologies led by next-generation FPGAs

FPGAs have become some of the most important drivers for development of leading edge semiconductor technology. The complexity of programmable devices, and their integration of diverse high-performance functions, provides excellent vehicles for testing new processes. It’s no accident that Intel has selected Achronix and Tabula, both makers of programmable devices, as the only partners that have been granted access to their 22 nm 3D Tri-Gate (FinFET) process. In February, Intel also announced an agreement with Altera, which will enable the company to manufacture FPGAs using their next-generation 14 nm Tri-Gate process.
Networking appliance, Console server, Embedded pc
In parallel with driving manufacturing, FPGA technology development must also include enhancements to design tools and flows. As vendors strive to make their devices more SoC- and ASIC-like, they are also adopting standards and collaborating with EDA companies to integrate their tools more seamlessly. These collaborations are producing great benefits for designers, as FPGA design methodologies are leading the way in areas that the EDA industry has long been promising new capabilities, such as in Electronic System Level (ESL) synthesis, IP integration and re-use, and higher-level tools for software/hardware co-design.
FPGA design methodologies have long integrated EDA point tools, such as simulation and PCB design, into FPGA vendor’s design platforms. Now, vendors such as Synopsys, with their Synplicity tools, and Xilinx with Vivado, are collaborating to build more complete integrated top-to-bottom flows. To address the greater complexity of FPGAs that may now contain up to two million equivalent logic cells, Synopsys has added Hierarchical Project Management (HPM) to Synplicity. HPM supports distributed design teams and parallel development, enabling partitioning of RTL and sharing of design debug tasks. Xilinx has adopted the industry-standard Synopsys Design Constraint (SDC) timing constraints (to replace Xilinx proprietary UDC) in a design flow that can be driven from standard Verilog HDL.


Easier integration and re-use of semiconductor IP, especially when sourcing from multiple vendors, has been one of the greatest challenges to SoC designers and EDA tool flows. With the advent of higher capacity FPGA-based SoCs that utilize embedded ARM cores, those same challenges are now extended to the world of FPGA design.
One of the methods that the EDA and IP industry has developed to ease the problem is the adoption of a standard for IP description formats, the IP-XACT standard. IP-XACT was originally developed by the SPIRIT Consortium of companies that included ARM, Cadence, Mentor, and Synopsys. SPIRIT merged with EDA Standards organization Accellera in 2010. The IEEE adopted IP-XACT as the IEEE Std-1685 in 2009, and has made the specification available to download free from the organization’s website. The specification defines the use of XML meta-data to document the characteristics of IP, and an API to enable integration with EDA tools.
Xilinx has announced that they are supporting IP-XACT in their new Vivado IP Integrator (IPI), to ease the integration of their own and third-party IP. IPI is available to Xilinx’s early access customers along with the release of the latest revision of the Vivado Design Suite 2013.1. In a demonstration video from Xilinx, IPI appears to provide a very easy to use schematic-driven graphical user interface, which enables “correct-by-construction” block-level assembly of complex designs. Xilinx says the system can also be run in a tcl script-driven mode.
IPI enables users to select IP blocks from a library, place the blocks on a schematic, and then simply point and click to draw the interconnections between blocks, I/O pins, and AXI busses. The system prevents invalid connections from being made, and alerts the user to errors with a built-in validation function. A user can start by selecting the target FPGA from the Vivado library or choose one of Xilinx’s evaluation boards, which will include information on other onboard components such as external DRAM, so that interfaces can be included as part of the FPGA design process. Designer assistance is provided to ease construction of larger functional blocks, such as MicroBlaze processor subsystems. After completion of the block-level design, and final DRC validation, users can utilize Vivado’s HDL generation functions to create Verilog or VHDL to drive synthesis and place and route.


Building on their 2011 acquisition of AutoESL, Xilinx also says that they have expanded their C/C++ system-level design library for High-Level Synthesis (HLS) in the new Vivado release. Xilinx is targeting the growing market for embedded vision applications, following on their participation as a founding member of the Embedded Vision Alliance, with support for industry standard floating point math.h operations and real-time video processing functions. Designers of embedded vision systems will be able to utilize Vivado HLS integrated with the Open Source Computer Vision Library provided by the OpenCV organization. OpenCV is an open source BSD-licensed library of computer vision functions, which supports Windows,Linux, Mac, Androidand Apple iOS operating systems. Vivado users will be able to develop embedded vision applications for the dual-core ARM Cortex A9 processor system in Zynq FPGAs, augmented with special-purpose hardware accelerators built in the programmable logic fabric.
Today’s most advanced SoCs are highly parallel heterogeneous computing systems, which challenge the traditional low-level HDL-based programming model. Altera has been leading the FPGA industry in promoting the use of OpenCL, an industry standard for parallel programming of systems containing a mix of CPUs, GPUs, and DSPs, which is maintained by the Khronos Group. In November last year, Altera released their first SDK for OpenCL to early access customers, as part of the version 12.1 update of their Quartus II suite of design tools. Hardware platforms that support the OpenCL SDK are becoming available, starting with the Nallatech 385 PCIe accelerator card, which employs Altera Stratix V FPGAs.


Advances in FPGA tools and flows are good news for designers of programmable logic systems as well as ASIC and SoC designers. At a recent Synopsys User Group tutorial on the Synplicity-Vivado flow, the large majority of attendees were involved in FPGA prototyping, where the latest high-capacity FPGAs have become critical tools for design validation and signoff for complex SoCs. By utilizing the same design languages and standards for both ASIC and FPGA design, much duplication of effort can be eliminated and faster time-to-market will result.



refer to :

2013年4月3日 星期三

Configurable AFE eases calibration trial and error

Networking appliance, Console server, Embedded pc
Looking at the hundreds of different types of sensors available, one can observe common topologies and signal characteristic ranges and understand that having the ability to simply change the characteristics of the op-amps, or to dynamically change the gain values, will significantly reduce the complexity and reduce development time.
The Renesas Smart Analog technology is an example of a fully configurable AFE technology that allows for such capability. As Figure 2 shows, such technology includes five elements: three separate configurable amplifiers, an additional amplifier with sync detection capability, a general-purpose op-amp, a low-pass filter with variable cutoff frequency, and lastly, a high-pass filter with variable cutoff frequency.
refer to: http://embedded-computing.com/articles/latest-afe-simplifies-interfacing-hundreds-sensors/#at_pco=cfd-1.0

2013年3月25日 星期一

What's IT managers need...

IT managers are under increasing pressure to boost network capacity and performance to cope with the data deluge. Networking systems are under a similar form of stress with their performance degrading as new capabilities are added in software. The solution to both needs is next-generation System-on-Chip (SoC) communications processors that combine multiple cores with multiple hardware acceleration engines.

In-Vehicle Computer. single board computer, Industrial PC  

1.Networks under increasing stress
2. Moore’s Law not keeping pace
3. Hardware acceleration necessary, but …
4.Next-generation multicore SoCs


2013年3月5日 星期二

Show longer medical device life expectancy

In vehicle computer, single board computer, Embedded pc

Like many other industries, health care has become much more agile as practitioners have tried to keep expenses under control. Smaller, more portable devices now enable more efficient and economical diagnostic and treatment procedures to be delivered at the patient’s bedside. Computers-On-Modules (COMs) are helping provide the portability, computing power, and integration needed to increase the longevity of medical device designs.

Electronic device manufacturers are increasingly using Computers-On-Modules (COMs) to produce compact, portable, and easily modified solutions for health care. In addition to smaller solutions, COMs enable longer product life, which is particularly desirable in medical equipment. One reason for this is the stringent and expensive certification process medical devices go through as mandated by the FDA. Furthermore, successful products often become industry standards that medical technicians must learn and adhere to.
By definition, COM designs are modular. The COM approach for embedded technology enables a medical solution’s processing power to be easily updated or upgraded while the physical dimensions and mounting system remain exactly the same. This allows the appearance of the industrial design to stay consistent with market expectations while providing for any needed upgrades. If a particular processor is reaching End-Of-Life (EOL), a module with a current processor can be introduced.
With COMs, the processor and supporting features are placed on a compact module that comprises a complete computer. The I/O for the system and the unique features that differentiate the customer’s product are included on a separate baseboard. Processor upgrades can be made by utilizing different processing modules that mate with the baseboard. This enables easy processor upgrades, plus various modules can be offered spanning a range of performance levels.

2013年2月25日 星期一

About designing remote health systems reaps rewards

Networking appliance, Console server, Embedded system
As the world’s population continues to age, remote health care ortelehealth devices are becoming an enormous growth area for the embedded systems industry. Low-cost, ubiquitously connected hardware and its associated services are rapidly growing in popularity, allowing doctors to monitor, diagnose, and treat specific health conditions remotely. Telehealth devices can also be used to provide remote data collection, patient reminders, multimedia content delivery, and wellness coaching by monitoring and adjusting the user’s daily fitness and diet.
For most health care device designs, embedded developers must address a number of common requirements, including a graphical interface and small form factor, patient safety, low-power operation, remote management, secure operation, and universal connectivity. In addition, these devices must be built with long-life support plus the ability to interoperate with other equipment in the field. Although hardware and software development for telehealth can be challenging, the rewards are significant, and manufacturers are rapidly seizing opportunities in the marketplace.
To delve into the latest technologies revolutionizing health care, we interviewed telehealth industry experts in this month’s Strategies section. Alan Boucher, Director of Software Architecture and Engineering at Intel-GE Care Innovations, a joint venture between Intel Corporation and GE Healthcare, explains how embedded technologies such as wireless connectivity, software, and sensors can be used to enable and enhance products in a telehealth environment. Also on the forefront of telehealth technology, Dr. Joseph Kvedar, founder and director of the Center for Connected Health, emphasizes the need for programs that move care from the hospital or doctor’s office into the day-to-day lives of patients by incorporating engagement strategies such as games, social networking, coaching, reminders, incentives, and punishments.


2013年2月19日 星期二

It is also the world’s biggest special-interest exhibition for embedded technologies

Networking appliance, Console server, Embedded pc
The international embedded community meets for three days at its annual highlight in Nürnberg from 26–28 February – the embedded world Exhibition&Conference. The exhibition has been the main hub of one of the most dynamic and highly specialized technology sectors for over 10 years. It is the world’s biggest international exhibition and conference event on embedded system technology. “embedded world will remain focused in 2013 but still grow appreciably. It is the largest event in the world for embedded system technologies and the most professional shop window,” explains Alexander Mattausch, Exhibition Manager of the embedded world Exhibition&Conference at NürnbergMesse.
embedded world has been the most important event in the international exhibition calendar for both exhibitors and visitors for a decade. For example, nine out of ten exhibitors at embedded world 2012 confirm that the event is of great or exceptional importance for their marketing and sales activities.
It is also the world’s biggest special-interest exhibition for embedded technologies. “We are very pleased about yet more growth in terms of display space, number of new exhibitors and international share of exhibitors, which confirms the importance of the event,” says Mattausch.
Acrosser technology  ---------------->Booth Hall 2 2-519

2013年2月5日 星期二

Intel dual- core 1.86GHz Atom Processor D2550 AMB-D255T1

Networking appliance, Console server, Embedded pc
Networking appliance, Console server, Embedded pc
Mini-ITX mainboard, AMB-D255T1, which carries the Intel dual- core 1.86GHz Atom Processor D2550.AMB-D255T1 also provides complete I/O such as 4 x COM ports, 6 x USB2.0 ports, 1 x GbE RJ-45 port, 1 x SATA port with power connector. AMB-D255T1 as the slim type with single layer I/O ports to make the board total height less than 20mm, with external AC/DC power adaptor which is very suitable for applications with limited space likes Digital Signage, POS or thin client system.
.1 x DDR3 SO-DIMM up to 4GB
.1 x VGA
.1 x HDMI
.1 x 24-bit LVDS
.6 x USB2.0
.4 x COM
.1 x GbE (Realtek RTL8105E)
.1 x PS/2 KB/MS
.1 x MiniPCIe slot
.1 x SATA with power connector
.8-bit GPIO